Exposição de Manufatura e Embalagem em Eletrônica 2027
NEPCON JAPAN is Asia’s leading electronics R&D, manufacturing and packaging exhibition, scheduled for 17‑19 February 2027 at Tokyo Big Sight. The event will host about 1,800 exhibitors and attract roughly 88,000 visitors. It comprises eight specialized shows, including the Power Device & Module Expo, IC Sensor Packaging Expo, PWB Expo, Fine Process Technology Expo, Electronic Components & Materials Expo, EMS & ODM Expo, Electrotest Japan, and InterNEPCON Japan. These categories cover power devices, semiconductor testing, sensor and packaging technologies, printed‑wire‑board production, advanced process equipment, component materials, and contract manufacturing services, providing a one‑stop venue for the entire electronics supply chain. The exhibition also features a technical conference program planned by industry experts.