IMAPS Nordic Annual Microelectronics and Packaging Conference and Exhibition 2026
The IMAPS Nordic Microelectronics Packaging Conference and Exhibition (NordPac) will take place 9‑11 June 2026 in Stockholm, Sweden. It gathers academics and industry leaders to discuss state‑of‑the‑art and future trends in microelectronics, advanced packaging, integration, reliability testing, PCB design, assembly and manufacturing, optics, health‑tech electronics, AI, and IoT. Call‑for‑papers topics include optoelectronics, harsh‑environment applications, photonic packaging, sensor‑system packaging, advanced packaging, reliability, materials, processes, medical electronics, thermal management, wearables, green and printed electronics. Exhibitor opportunities feature table packages (one table €1,300 with one free participant; two tables €2,300 with two free participants) that include exhibition space, presenter slots, logo placement in the conference booklet and website, and a LinkedIn promotion. Contact Hoang‑Vu Nguyen or Anders Petersen at [email protected] for participation.
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Tampere - Tampere, Pirkanmaa, Finlândia