Power Device & Module Expo - NEPCON JAPAN 2027 2027
De
Fevereiro 17, 2027
até
Fevereiro 19, 2027
(Por favor, verifique novamente as datas e localização abaixo com o organizador antes de participar.)
Power Device & Module Expo is one of the eight specialised shows comprising NEPCON JAPAN 2027 (the 41st edition), Asia's leading exhibition for electronics R&D, manufacturing and packaging technology. It is held 17-19 February 2027 at Tokyo Big Sight, Tokyo, Japan, organised by RX Japan. The expo focuses on power electronics: SiC/GaN semiconductors, power modules, thermal management, control/drive/sensing and related materials and manufacturing equipment. Concurrent shows include INTERNEPCON JAPAN, ELECTROTEST JAPAN and IC & Sensor Packaging Expo.
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Please register at the organizer website of Power Device & Module Expo - NEPCON JAPAN 2027
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