InterPACK 2026
InterPACK 2026, held October 26‑29 in San Diego, is the premier ASME conference on electronic and photonic packaging. It showcases cutting‑edge research, development, and manufacturing across a broad spectrum of categories: Heterogeneous Integration, Data‑Center and Modular Edge Systems, Information Storage, Extreme‑Environment Electronics, Power/RF Electronics and Photonics, Nanoscale Heat Transfer and Energy Storage, Flexible, Wearable and Printed Electronics, Intelligent Modeling/Simulation/Automation, and Micro/Nano Mechatronics and IoT applications. The event features technical paper sessions, industry exhibits, panel discussions, workshops, tutorials, and keynote talks, fostering collaboration among industry leaders, academia, national labs, startups, and funding agencies.
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San Jose - Holiday Inn San Jose - Silicon Valley, Califórnia, EUA