Power Device and Module Expo 2027
De
Fevereiro 17, 2027
até
Fevereiro 19, 2027
(Por favor, verifique novamente as datas e localização abaixo com o organizador antes de participar.)
Categorias:Indústria Elétrica
The NEPCON Japan Tokyo Show, held at Tokyo Big Sight from February 17 to 19, 2027, brings together a series of specialized expos covering the full spectrum of electronic manufacturing. Key categories include InterNEPCON Japan, Electrotest Japan, IC Sensor Packaging Expo, Electronic Components & Materials Expo, PWB (Printed Wiring Board) Expo, Fine Process Technology Expo, Power Device and Module Expo, and EMS & ODM Expo. The event showcases the latest technologies, products, and services for the semiconductor, packaging, component, and manufacturing sectors, attracting industry professionals, suppliers, and innovators from around the world.
Se inscreva para entrada ou estandes
Please register at the organizer website of Power Device and Module Expo
Mapa do Local e Hotéis nas Redondezas
Koto - Tokyo Big Sight, Tóquio, Japão